HIS包含了哪些层面的应用系统，分别为「医疗相关资讯系统」、「行政管理相关资讯系统」及「基础建设与医院相关系统」。

医院管理和医疗活动中进行信息管理和联机操作的计算机应用系统,英文缩写HIS。HIS是覆盖医院所有业务和业务全过程的信息管理系统。利用电子计算机和通讯设备，为医院所属各部门提供病人诊疗信息和行政管理信息的收集、存储、处理、提取和数据交换的能力并满足授权用户需求的平台。 

欣扬提供理想的医疗应用嵌入式解决方案医疗仪器通常需特殊，并受到高度严格标准的规范。欣扬提供理想的医疗应用嵌入式解决方案。 

HIS包含了哪些层面的应用系统，分别为「医疗相关资讯系统」、「行政管理相关资讯系统」及「基础建设与医院相关系统」。 

医疗资讯系统旗下系统包括：门诊系统、入院出院转诊系统、医嘱系统、护理系统、检验系统、药品与卫材系统、影像与放射资讯系统、手术与麻醉系统、重症照护系统、营养系统，以及电子病历管理系统。 

基础建设与医院相关系统则区分为：编码、讯息与软体开发标准、病人安全系统、资讯安全、公共卫生通报与监测系统、社区医疗资讯系统、紧急医疗危机应变系统、行动无线运算平台资讯系统以及参考资讯架构。 

医院的医疗系统相当复杂繁琐，各个子系统或资料库之间的关联密切，必须不断交叉分析，无法切割成独立的区块。试想看看，从病患走进医院后的病历建档、批价挂号、检验报告，一直到医护人员开设医令、处方笺、看诊记录等，各科室之间的资料必须快速传递分析，一个病患在短短的就诊过程中，就会动用到不同的子系统与资料库。 

除此之外，即便是标准的医疗流程，也会遇到许多突发状况，不仅使用者可在任何时间点切入流程，而且切入的理由有百百种。例如，病患忘了带健保卡，医护人员为了先让病患看病，而变更病患系统内的健保身分，设定成自费，等下次病患再拿着健保卡去柜台，设定回原先的健保身分，才能退款。面对医疗体系复杂的运作流程，医疗系统的功用就是要将实际的医疗流程串起来，辅助医护人员提供更有保障的医疗服务。 


透过欣扬出色的产品、迅速的技术支持与多年的医疗产业经验，协助您医疗流程可藉由医疗应用嵌入式解决方案来落实。

Acrosser's 2 Mini-ITX mainboards with diversified application

With a total board height less than 20mm, the slim fit feature of AMB-D255T1 makes it a perfect applicationalmost everywhere. With single layer I/O ports and external +12V DC power input, AMB-D255T1 can easily be equipped even in limited spaces like digital signage, POS or thin client systems. Also, the supporting video source includes both VGA and HDMI outputs to cater to a variety of needs. Many digital signage partners have showed great interests toward AMB-D255T1 for their business sector. AMB-D255T1 has one DDR3 SO-DIMM which supports up to 4GB DDR3 memory, mSATA socket with USB signals and SIM slot, and a DC jack for easy power in. For customers that are taking their entire system to the next level, AMB-D255T1 provides one PCI slot and one Mini PCIe expansion slot with a SIM card socket for further improvement. The mini PCIe expansion allows mSATA to function together with the system or multi module choices for USB signals module installation.( mSATA storage, Wi-Fi module, or 3G/4G telecommunication)

The key features of the AMB-D255T1 include: ．Intel Atom D2550 1.86GHz ．1 x DDR3 SO-DIMM up to 4GB ．1 x VGA ．1 x HDMI ．1 x 24-bit LVDS ．6 x USB2.0 ．4 x COM ．1 x GbE (Realtek RTL8105E) ．1 x PS/2 KB/MS ．1 x PCI slot ．1 x MiniPCIe slot for mSATA and USB device ．1 x SATA with power connector ．8-bit GPIO

AMB-QM77T1 is dedicated to multiple applications, such as industrial automations, kiosks, digital signages, and ATM machines. Supporting 3rd generation Intel core i processor, AMB-QM77T1 features an integrated GPU to support the following graphic libraries: DirectX11, OpenGL4.0 and OpenCL1.1. As for numbers of output, a maximum of 3 independent displays are supplied, which is a perfect solution for gaming/multimedia business. In addition, 4 USB3.0 and 2 SATA III connectors result in high data transmission.

COM Express(tm) modules with AMD Embedded R-Series

A new starter kit for COM Express(tm) modules with AMD Embedded R-Series Accelerated Processing Unit (APU) is now available. The intelligent starter kit MSC C6-SK-A7-T6T2 contains a COM Express(tm) Type 6 baseboard, an active heat sink with fan and two DDR3 memory modules.


The intelligent starter kit MSC C6-SK-A7-T6T2 contains a COM Express™ Type 6 baseboard, an active heat sink with fan and two DDR3 memory modules. Users of the kit are free to choose one of four COM Express™ Type 6 computer modules with Embedded R-Series APU from MSC’s MSC C6C-A7 product family. Furthermore, the starter kit is also offered with a 15 inch XGA TFT display with LED backlight. Different display types or touch screen panels are available on request.


The compact baseboard with dimensions of 140 mm x 184 mm offers the module socket and numerous important connectors, above all the newly available Type 6 interfaces defined in the COM Express™ specification V2.0. The interfaces include configurable Digital Display Interfaces (DDI) which can be used via three each DisplayPort and HDMI connectors and a DVI port. In addition, four USB 3.0 ports, Ethernet, VGA, HD audio, SATA and even a PCI Express™ x4 slot also found place onboard.................




refer to:http://smallformfactors.com/news/msc-kit-com-expresstm-type-modules/#at_pco=cfd-1.0

2013 ESEC!

ACROSSER Technology announces our participation in 2013 the Embedded Systems Expo and Conference (ESEC) from May 8th to the 10th. The event will take place at the Tokyo International Exhibition Center in Tokyo, Japan. We warmly invite all customers to come and meet us at the west hall, booth number: WEST 10-61.

AMD Embedded G-Series APU to bring the optimum combination of computing power

A new All-in-One Gaming Board, the AMB-A55EG1. AMB-A55EG1 features AMD Embedded G-Series T56N 1.65GHz dual-core APU, two DDR3-1333 SO-DIMM, which provides great computing and graphic performance is suitable for casino gaming and amusement applications. It is designed to comply with the most gaming regulations including GLI, BMM, and Comma 6A. AMB-A55EG1 is specifically designed to be a cost competitive solution for the entry-level gaming market.

In conclusion, AMB-A55EG1 bridges Acrosser’s innovated gaming solutions and AMD Embedded G-Series APU to bring the optimum combination of computing power, graphic performance, and gaming features. Acrosser supports all gaming products in Windows XP Pro, XP embedded and mainstream Linux operation system with complete software development kit (SDK).  In addition, Acrosser’s gaming platforms have a minimum 5-year availability to fulfill the demand of long term supply in gaming industry.

Contact：
http://www.acrosser.com/inquiry.html

Milestone events in the EDA industry

This seems to be the year for milestone events in the EDA industry, though calculations show some of the “anniversary” designations to be premature. Nevertheless, the first big EDA event of the year is the Design and Verification Conference (DVCon), held in San Jose, CA every February. DVCon celebrated its 10th anniversary this year, after a transformation from HDLcon in 2003, which followed the earlier union of the VHDL International User’s Forum and International Verilog HDL Conference. Those predecessor conferences trace their origins back 25 years and 20 years, respectively.

After DVCon, EDA marketers quickly turn to preparations for the June Design Automation Conference (DAC), perhaps with a warm-up at Design, Automation, and Test in Europe (DATE) in March. DAC is the big show, however, and this year marks the 50th such event (and its 49th anniversary). Phil Kaufman Award winner Pat Pistilli received the EDA industry’s’ highest honor for his pioneer work in creating DAC, which grew from his amusingly-named Society to Help Avoid Redundant Effort (SHARE) conference in 1964.

Milestones inevitably lead to some reflection, but also provide an opportunity to look forward to what the future will bring. In our 2nd annual EDA Digest Resource Guide, we will be asking EDA companies to share what they see as the biggest challenges facing the industry in the next five years, and how the industry will change to meet those challenges. Will future innovations be able to match the impact of the greatest past developments in EDA, which enabled the advances in electronics that we benefit from today?


.......

refer to : http://dsp-fpga.com/articles/looking-back-at-the-milestones-as-dac-50-approaches/

AIS Introduces Low Cost Industrial Touch Screen Display Monitor

American Industrial Systems Inc. (AIS), has introduced a complete line of industrial touchscreen LCD monitors in several mechanical designs and paired with the latest in touchscreen technology to fit every situation.

IRVINE, CA -- American Industrial Systems Inc. (AIS), has introduced a complete line of industrial touchscreen monitors in several mechanical designs and paired with the latest in touchscreen technology to fit every situation. The monitors are currently available in open frame,chassis, panel mount, IP65 mount bezel, and rack mount to cover most industrial requirements. Also available are AIS’ rugged touchscreen display line, built to handle the most extreme of environments, which include vehicle mount touch screen display, Full IP65, and Marine grade touchscreen bridge displays. The need for touchscreen HMI displays in today’s market is growing in every industry whether it is retail, digital signage, military, industrial, or gaming; AIS’ has the products, technology, and price competitiveness to bring you to market faster.

AIS touchscreen displays utilize industrial grade components and are encased in steel, aluminum, or aluminum-magnesium alloys for maximum reliability and protection from shock/vibration, Wide Temperature Range Operation and harsh environmental conditions. Add-on enhancements are available such customize the LCD to perfectly fit applications such as sunlight readable touchscreen LCD enhancements, wide voltage range inputs, Anti-corrosion coatings, IP65 Water/Dustproof rating, and Touch screen integration. Several touchscreen technologies are available including resistive, capacitive, infra red (IR), surface acoustic wave (SAW), and 3M MicroTouch™ DST Touch System for Large size screens. Together AIS has thousands of pre-engineered, documented and tested touch screen LCD solutions at cost effective prices.

Features & Benefits:

• Industrial Grade Displays

• Ruggedized Housings

• 6.4” to 42” in Size

• IP65 Water and Dustproof Rating

• Sunlight Readability Enhancements

• Transflective Passive Enhancements

• High Brightness Displays

Touch screen Technology

o Resistive Touch Screen Technology

o The cost effective workhorse of touch technologies

o Surface Acoustic Wave (SAW) Touch Screen Technology

o Superior optical characteristics for best clarity

o Capacitive Touch Screen Technology

o Durable, cost effective solution, impervious to on-screen contaminants

o Infrared Touch Screen Technology

o Suitable for harsh environments and outdoor applications

o Large touch screens for digital signage

About American Industrial Systems Inc.

refer to :

http://industrial-embedded.com/news/ais-gaming-digital-signage-industries/0/

Communications networking....

IT managers are under increasing pressure to boost network capacity and performance to cope with the data deluge. Networking systems are under a similar form of stress with their performance degrading as new capabilities are added in software. The solution to both needs is next-generation System-on-Chip (SoC) communications processors that combine multiple cores with multiple hardware acceleration engines.

The data deluge, with its massive growth in both mobile and enterprise network traffic, is driving substantial changes in the architectures of base stations, routers, gateways, and other networking systems. To maintain high performance as traffic volume and velocity continue to grow, next-generation communications processors combine multicore processors with specialized hardware acceleration engines in SoC ICs.

The following discussion examines the role of the SoC in today’s network infrastructures, as well as how the SoC will evolve in coming years. Before doing so, it is instructive to consider some of the trends driving this need.

Networks under increasing stress

In mobile networks, per-user access bandwidth is increasing by more than an order of magnitude from 200-300 Mbps in 3G networks to 3-5 Gbps in 4G Long-Term Evolution (LTE) networks. Advanced LTE technology will double bandwidth again to 5-10 Gbps. Higher-speed access networks will need more and smaller cells to deliver these data rates reliably to a growing number of mobile devices.

In response to these and other trends, mobile base station features are changing significantly. Multiple radios are being used in cloud-like distributed antenna systems. Network topologies are flattening. Operators are offering advanced Quality of Service (QoS) and location-based services and moving to application-aware billing. The increased volume of traffic will begin to place considerable stress on both the access and backhaul portions of the network.

Traffic is similarly exploding within data center networks. Organizations are pursuing limitless-scale computing workloads on virtual machines, which is breaking many of the traditional networking protocols and procedures. The network itself is also becoming virtual and shifting to a Network-as-a-Service (NaaS) paradigm, which is driving organizations to a more flexible Software-Defined Networking (SDN) architecture.

These trends will transform the data center into a private cloud with a service-oriented network. This private cloud will need to interact more seamlessly and securely with public cloud offerings in hybrid arrangements. The result will be the need for greater intelligence, scalability, and flexibility throughout the network.

Moore’s Law not keeping pace

Once upon a time, Moore’s Law – the doubling of processor performance every 18 months or so – was sufficient to keep pace with computing and networking requirements. Hardware and software advanced in lockstep in both computers and networking equipment. As software added more features with greater sophistication, advances in processors maintained satisfactory levels of performance. But then along came the data deluge.

In mobile networks, for example, traffic volume is growing by some 78 percent per year, owing mostly to the increase in video traffic. This is already causing considerable congestion, and the problem will only get worse when an estimated 50 billion mobile devices are in use by 2016 and the total volume of traffic grows by a factor of 50 in the coming decade.

In data centers, data volume and velocity are also growing exponentially. According to IDC, digital data creation is rising 60 percent per year. The research firm’s Digital Universe Study predicts that annual data creation will grow 44-fold between 2009 and 2020 to 35 zettabytes (35 trillion gigabytes). All of this data must be moved, stored, and analyzed, making Big Data a big problem for most organizations today.

With the data deluge demanding more from network infrastructures, vendors have applied a Band-Aid to the problem by adding new software-based features and functions in networking equipment. Software has now grown so complex that hardware has fallen behind. One way for hardware to catch up is to use processors with multiple cores. If one general-purpose processor is not enough, try two, four, 16, or more.

Another way to improve hardware performance is to combine something new – multiple cores – with something old – Reduced Instruction Set Computing (RISC) technology. With RISC, less is more based on the uniform register file load/store architecture and simple addressing modes. ARM, for example, has made some enhancements to the basic RISC architecture to achieve a better balance of high performance, small code size, low power consumption, and small silicon area, with the last two factors being important to increasing the core count.

Hardware acceleration necessary, but …

General-purpose processors, regardless of the number of cores, are simply too slow for functions that must operate deep inside every packet, such as packet classification, cryptographic security, and traffic management, which is needed for intelligent QoS. Because these functions must often be performed in serial fashion, there is limited opportunity to process them simultaneously in multiple cores. For these reasons, such functions have long been performed in hardware, and it is increasingly common to have these hardware accelerators integrated with multicore processors in specialized SoC communications processors.

The number of function-specific acceleration engines available also continues to grow, and more engines (along with more cores) can now be placed on a single SoC. Examples of acceleration engines include packet classification, deep packet inspection, encryption/decryption, digital signal processing, transcoding, and traffic management. It is even possible now to integrate a system vendor’s unique intellectual property into a custom acceleration engine within an SoC. Taken together, these advances make it possible to replace multiple SoCs with a single SoC in many networking systems (see Figure 1).

Figure 1: SoC communications processors combine multiple general-purpose processor cores with multiple task-specific acceleration engines to deliver higher performance with a lower component count and lower power consumption. (Click graphic to zoom by 1.9x)

In addition to delivering higher throughput, SoCs reduce the cost of equipment, resulting in a significant price/performance improvement. Furthermore, the ability to tightly couple multiple acceleration engines makes it easier to satisfy end-to-end QoS and service-level agreement requirements. The SoC also offers a distinct advantage when it comes to power consumption, which is an increasingly important consideration in network infrastructures, by providing the ability to replace multiple discrete components in a single energy-efficient IC.

The powerful capabilities of today’s SoCs make it possible to offload packet processing entirely to system line cards such as a router or switch. In distributed architectures like the IP Multimedia System and SDN, the offload can similarly be distributed among multiple systems, including servers.

Although hardware acceleration is necessary, the way it is implemented in some SoCs today may no longer be sufficient in applications requiring deterministic performance. The problem is caused by the workflow within the SoC itself when packets must pass through several hardware accelerators, which is increasingly the case for systems tasked with inspecting, transforming, securing, and otherwise manipulating traffic.

If traffic must be handled by a general-purpose processor each time it passes through a different acceleration engine, latency can increase dramatically, and deterministic performance cannot be guaranteed under all circumstances. This problem will get worse as data rates increase in Ethernet networks from 1 Gbps to 10 Gbps, and in mobile networks from 300 Mbps in 3G networks to 5 Gbps in 4G networks.

Next-generation multicore SoCs

LSI addresses the data path problem in its Axxia SoCs with Virtual Pipeline technology. The Virtual Pipeline creates a message-passing control path that enables system designers to dynamically specify different packet-processing flows that require different combinations of multiple acceleration engines. Each traffic flow is then processed directly through any engine in any desired sequence without intervention from a general-purpose processor (see Figure 2). This design natively supports connecting different heterogeneous cores together, enabling more flexibility and better power optimization.

Figure 2: To maximize performance, next-generation SoC communications processors process packets directly and sequentially in multiple acceleration engines without intermediate intervention from the CPU cores. (Click graphic to zoom)

In addition to faster, more efficient packet processing, next-generation SoCs also include more general-purpose processor cores (to 32, 64, and beyond), highly scalable and lower-latency interconnects, nonblocking switching, and a wider choice of standard interfaces (Serial RapidIO, PCI Express, USB, I2C, and SATA) and higher-speed Ethernet interfaces (1G, 2.5G, 10G, and 40G+). To easily integrate these increasingly sophisticated capabilities into a system’s design, software development kits are enhanced with tools that simplify development, testing, debugging, and optimization tasks.

Next-generation SoC ICs accelerate time to market for new products while lowering both manufacturing costs and power consumption. With deterministic performance for data rates in excess of 40 Gbps, embedded hardware is once again poised to accommodate any additional capabilities required by the data deluge for another three to four years.

refer:http://embedded-computing.com/articles/next-generation-architectures-tomorrows-communications-networks/

About wireless networks

802.11 networks are becoming nearly ubiquitous in many enterprise settings and can often be tapped to solve embedded problems in the same location. In this example, a logistics cart used for warehouse operations becomes 802.11 enabled, improving the efficiency of a critical process.

In a tough economy with increased competition from global markets, companies are forced to do more with less. Supply chain management is one area where companies realize this challenge. Organizations are continually struggling to ship more orders, decrease processing time, and increase order accuracy, all the while reducing costs. The nature of order processing has changed as well. With just-in-time and lean manufacturing techniques becoming common practices, distribution warehouses often need to process a high volume of small orders, which often involve a large mix of products, adding further complexity to the process.

The end result is that the order picking process is increasingly challenging. In a typical warehouse or distribution center, studies have shown that order picking can consume as much as two-thirds of the facility’s operating cost and time. As a result, companies are continually looking for new technologies and innovations to automate the order picking process.


refer: http://embedded-computing.com/articles/wireless-networks-provide-with-less/

Advanced Digital Logic (ADL) Releases ADLGS45PC – Intel Core 2 Duo / Celeron M 1.20GHz – 2.26GHz, PCI/104-Express Single Board Computer

The ADLGS45PC delivers high performance and managed thermals in a compact form factor.

SAN DIEGO, CA, April 26, 2010 -Advanced Digital Logic (ADL) a leading provider of embedded industrial single board computers, systems, peripherals and accessories for embedded and stand alone applications, today announced the release of its ADLGS45PC single board computer. The ADLGS45PC is based on the Intel® CoreTM 2 Duo / Celeron® M Small Form Factor (SFF) processors and the Intel® GS45 Express (CantigaTM) chipset. Built on the 45nm process, the ADLGS45PC sets a new standard with managed thermals, combined with superior performance in an embedded PCI/104-Express form factor. The Intel® Core 2 Duo SFF and Celeron® M SFF processors guarantee the benefits of genuine Intel® architecture to small form factor and thermally constrained markets. The Intel® GS45 Express GMCH coupled with the Intel® ICH9M-E I/O controller hub offers an impressive list of high performance features that makes full-size board makers nervous.

The ADLGS45PC takes advantage of these features by delivering high performance and managed thermals in a compact form factor. The Intel® graphics controller drives a CRT to 2048x1536 and/or 18/24/36/48 bit LVDS LCD to 1600x1200 resolution. Memory is added via an SODIMM204 socket that will accept up to 2GB of DDR3-1066 DRAM. In addition to ACPI/APM functions, the ADLGS45PC has the following features: 8x USB 2.0, 2x RS232/422/485 COM ports, PS/2 Keyboard and Mouse, LPT, AC97 Sound / 7.1 HDA, and 2x 10/100/1000MBit LAN. The ADLGS45PC also includes 4 onboard SATA 3GB ports with RAID 0/1/5/10 support.

"The ADLGS45PC comes equipped with features that many of the full size motherboards don't offer. The onboard 4-channel SATA 3GB RAID coupled with onboard dual Gigabit Ethernet LAN ports, 2GB of DDR3-1066MHz, and Dual core processing up to 2.26GHz, brings a new level of performance and data power to PC/104, even before PCI/104-Express peripherals are added," said Matt Henry, Product Manager-Verification Engineer of Advanced Digital Logic.

refer:

http://embedded-computing.com/news/advanced-single-board-computer/

Embedded DisplayPort: Increased flexibility and power savings render greater display efficiency

 While mobile device display performance continues to increase, system chip processes geometries continue to shrink, resulting in a greater proportion of system power consumed by the display and its high-speed interface. The new Embedded Display Port (eDP) v1.4 standard offers several new features that maximize system power efficiency, further consolidate the display interface, and address a wide range of system profiles to satisfy the growing demand for power optimization in the embedded display system.

 The Video Electronics Standards Association (VESA) first released the Embedded Display Port (eDP) standard in 2009 as an extension of the DisplayPort standard for use with embedded displays. VESA developed eDP to replace the aging Low-Voltage Differential Signaling (LVDS) standard, and today eDP is used widely in notebook computers and all-in-one systems. The primary benefits of eDP over LVDS include the reduction of signal wires due to its higher data rate, compatibility with submicron chip processes, decreased interference with wireless services, and its ability to accommodate new features.

 

 refer:

http://embedded-computing.com/articles/embedded-greater-display-efficiency/#at_pco=cfd-1.0

 

About VIA Eden Processor Applications

With its signature fanless operation, the VIA Eden™ processor family targets personal, business, industrial and commercial embedded computing devices that require ultra low power consumption, rock solid reliability and compatibility with standard x86 operating systems and software applications.

VIA Eden Processor Applications

The low power consumption, excellent heat dissipation and leading power efficiency makes the VIA Eden processor ideal for a wide range of compact, quiet devices for the home, office, car, shops, hospitals, public institutions, industrial plants and much.

Secure by Design

VIA Eden processors are helping to herald an era of practical pervasive security thanks to the VIA PadLock Security Engine, the world's fastest x86 security engine in the world featuring the most comprehensive suite of tools for key cryptographic operations.

from
http://www.via.com.tw/en/products/processors/eden/

3.5 Inch Embedded Single board computer with Intel Atom Processor “Cedar Trial” N2800

AMB-N280S1, which carries Intel dual- core 1.8 GHz Atom Processor N2800. Acrosser takes advantage of Atom Cedar Trail N2000 series processor in design, such as low power consumption and small footprint as former Atom series. With fanless design AMB-N280S1 has one SO-DIMM supports DDR3 memory to maximum 4GB. Focusing on embedded and industrial applications, AMB-N280S1 has variety I/O ports like 6 x serial ports (one is RS-232/485 selectable), 4 x USB2.0, 2 x GbE, and one Mini-PCIe expansion. It also offers 1 x SATA interface and power connector for the customers have large storage capacity request.

Intel Atom Processor N2800 provides more powerful graphic performance by less power consumption. There are one HDMI port and one VGA output on AMB-N280S1 can support both two displays to maximum resolution 1920 x 1200. It also offers the 18-bit LVDS interface for small size LCD panel. There are two Mini-PCIe expansion slots for customer’s expansion. One on the upper side comes with SIM card socket, PCIe signals, and USB signals that can be equipped with 3G/4G telecommunication module. The other one on the bottom side is designed with SATA signals especially for mSATA storage module.

 

Rackmount networking platforms based on Intel Core 2 Quad/Duo

AR-R5800A is a rack mount networking platforms based on Intel Core 2 Quad/Duo cores processor. They feature a 1U rack mount chassis, maximum 4GB DDR3 memory, 8 x GbE and 2 x Fiber SFP LAN ports, 2 x LAN bypass, 4 x USB ports, 2 x SATA HDD and console port.

Industrial PC ,Console server ,networking appliance

In addition, AR-R5800A uses 80 Plus PSU which can save the electricity bill and protect the environment.  The mini-PCI slots enable system integrator to add extra features such as Wi-Fi or security accelerator to these platforms. The software and hardware configurable LAN bypass feature also avoids the communication breaking due to power loss or system hang up.

AR-R5800A is available now. For more information, please contact ACROSSER Technology, ACROSSER USA, and ACROSSER worldwide resellers in your local area.

Key features:

1. Support Intel Core 2 Quad or Core 2 Duo or Pentium or Celeron CPU

2. Intel G41 + ICH7R Chipset to support RAID 0/1 redundancy

3. DDRIII DIMM x 2, up to 4GB memory.

4. Intel 82576EB x 2 GbE Fiber

5. Intel 82574L 10/100/1000Mbps x 6 + 82541PI 10/100/1000Mbps x 2

6. Two pairs LAN ports support bypass feature (LAN 1/2 + LAN 3/4)

7. LAN bypass can be controlled by BIOS, GPIO and Jumper

8. CF socket, 2.5” HDD x 2, SATA II interface x 2

9. Console, VGA (pinhead), USB 2.0 x 4 (2 x connectors, 2 x pin head)

10. Support boot from LAN, console redirection

11. Equipped with 80 Plus Bronze PSU to decrease CO2 dissipation and protect our environment

12. LCM module to provide user-friendly interface13. Standard 1U rack mount size